Design of a Thermopressed Bonding Vacuum Box for Microfluidic Chips

Zhiyu Liu

doi:10.54097/ajst.v5i2.6463

Authors

Zhiyu Liu

DOI:

https://doi.org/10.54097/ajst.v5i2.6463

Keywords:

Microfluidic chips, Hot press bonding, Vacuum structure.

Abstract

In this paper, a vacuum chamber is designed to facilitate the hot pressing bonding of microfluidic chips, according to the current microfluidic chip hot pressing bonding process, chip deformation, flow channel edge bubbles and other problems, Hot-pressed bonding in a vacuum device is proposed to hot-press the chip, combined with the structure of the heat press, the structure of the vacuum box, the connection line, etc. were designed, use solidworks3D modeling, the design, production, assembly and experiment of the vacuum hot pressing device were completed.

Downloads

Download data is not yet available.

References

Jacobson S C,Hergenronder R,Koutny L B,et al.High-speed seParations on a microchip [J]. Anal. Chem. 1994, (66): 1114-1118.

FANG Zhaolun. Microfluidic analysis chip [M]. Beijing, Science Press. 2002,(1).

Wu Linghai. Research on vacuum hot pressing bonding system of polymer microfluidic chip[D]. Guangzhou:Guangdong University of Technology,2018.

YE Jiaming, LI Mingjia, ZHOU Yongliang. Rapid production of microfluidic chip mold by hot pressing method[J].China Mechanical Engineering, 2007,(19):2379-2382.)