A Review of Common Acceleration Models in Accelerated Life Testing

Ling Zhao

doi:10.54097/r1q2ve60

Authors

Ling Zhao

DOI:

https://doi.org/10.54097/r1q2ve60

Keywords:

Accelerated life testing, acceleration mode, reliability, accelerated lifetime.

Abstract

The core of accelerated life testing (ALT) is the development of acceleration models. These models can be classified into three types based on their underlying methodologies: physics-based, empirical inductive, and statistical inference models. This paper primarily examines the acceleration models that are commonly applied in engineering practice and presents the relevant computational formulas to highlight the fundamental research methodologies of ALT. Additionally, the paper underscores that ALT is increasingly recognized as a vital and emerging trend, driven by its role in shortening design cycles, enhancing product reliability, and managing costs.

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References

[1] Nelson W. Accelerated testing: statistical methods, test plans,and data analysisM. New York: John Wiley Press,1990.

[2] Meeker W Q,Escobar L A, LuJC. Accelerated degradation tests: modeling and analysis. Technometrics, 1998,40(2):89-99.

[3] Yurkowsky W, Schafter R E, Finkelstein J M. Accelerated testing technology, RADC TR 67 420 [R]. Rome Air Development Center, 1967:1-2.

[4] Criscimagna N H,Accelerated testinglG]// Selected Topics in Assurance Related Technologies, RAC,1999,6(4):1-6.

[5] Nelson W. Accelerated testing: statistical methods, test plans,and data analysisM. New York: John Wiley Press,1990.

[6] Nelson W B, Meeker w Q. Theory for optimum censored accelerated life tests for Weibull and extreme value distributions Technometrics, 1978, 20(2):171-177.

[7] Nelson W B. Accelerated life testing step stress models and data analysis [. IEEE Transactions on Reliability, 1980,29(2):103-108.

[8] GE Guang ping, MA Hai xun, HE You hua. Data analysis fromaccelerated life test using step stress and weibull distribution[C Beijing:ICRMS, 1994:39-41

[9] MAO Shi song,WANG Ling ling. Accelerated life test [M] Beijing:Science Press, 2000:6-30.

[10] ZHANG Chun hua, WEN Xi sen, CYEN Xun. Accelerated life test:an intmductory review, Acta Armamentarii, 2004, 25(4): 484-490.

[11] ZHANG Chun hua,CHEN Xun, WEN Xi sen. Step down stress accelerated life testing-methodology. Acta Armamentarii,2005, 26(4): 661-665.

[12] ZHANG Chunhua, CHEN Xun, WEN Xisen. Step downstress accelerated life testing-statistical analysis. Acta Armamentarii, 2005, 26(4): 666-669.

[13] LIN Zheng ning, FEl He liang. A nonparametric approach toprogressive stress accelerated life testing. IEEE Transactionson Reliability, 1991, 40(2):173-176.

[14] YANG Guang bin, Optimum constant stress accelerated life testplans[,IEEE Transactions on Reliability,1994，43(4):575-581.

[15] Khamis I H, Higgins J J. Optimum 3 step step stress tests [j]IEEE Transactions on Reliability,1996，45(2):341-345.

[16] ZHANG Ping ping. Study and application of accelerated life test for aviation products [. Journal of Beijing University of Aeronautics and Astronautics,1995,21(4):124-129.

[17] Meek W Q. Limited failure population life tests: application to integrated circuit reliability. Technometrics, 1987, 29(1):51-65.

[18] CHEN Xun, TAO Jun yong, ZHANG Chun hua. Reliability en hancement testing and accelerated life testing: an introductory review J. Journal of National University of Defense Technology, 2002, 24 (2):29-32.

[19] McLinn J A. New analysis methods of multilevel accelerated lifetests . 1EEE Proceedings of Annual Reliability and Maintainability Symposium, 1999:38-42.

[20] CUI H. Accelerated Temperature Cycle Test and Coffin-M-anson Model for Electronic Packaging[C]. RAMS，2005.

[21] FALLOU B, BURUIERE C, MOREL J F. First approach on multiple stress accelerated life testing of electrical insu- lation [ C] //NRC Conference on electrical insulation and dielectric phenomena in Pocono, 1979, 621-628.

[22] SIMONI L, MAZZANTI G. A general multi-stress life mod-el for insulation materials with or without evidence for thresholds [J] . IEEE Transaction on electrical insulation, 1993, 16 (3) 349-364.

[23] MONTANARI G C, CACCIARI M. A probabilistic lifemodel for insulation materials showing electrical threshold[J]. IEEE Transaction on electrical in sulation,1989,24(1) :127-137.

[24] PECKN D S. Comperhensive model for humidity testing cor-relation [C] //Proceeding of 24th Annual international reli-ability physics symposium, 1986:44-50.

[25] SILVERMAN M. Accelerated reliability test techniques used to find defects within printed circuitboards [C] //Proceed-ings of Annual Technical Meetings on Design, Test, and Evaluation Product Reliability Institute of EnvironmentalSeiences, 1998: 283-285.

[26] SRINIVAS M B, RAMU T S . Multifactor aging of HVgenerator stator insulation including mechanical vibration [J] . IEEE Transaction on Electrical Insulation,n 1992, 27(5): 1009-1021.