From Material Properties to System Architecture: Exploring Collaborative Pathways for Semiconductor Innovation in the Post-Moore Era

Haotian Liu

doi:10.54097/44dbh636

Authors

Haotian Liu

DOI:

https://doi.org/10.54097/44dbh636

Keywords:

Moore’s Law; Chip Industry; Manufacturing Process.

Abstract

When the traditional silicon-based semiconductor chip industry encounters bottlenecks caused by physical limits and can no longer follow Moore’s Law—that is, when it enters the post-Moore era—how should it move forward? This paper discusses why the chip industry cannot continue its linear process scaling, taking quantum tunneling (e.g., electron tunneling), Compton scattering, and economic factors as examples. It then explores corresponding solutions from the perspectives of packaging, architecture, and materials. In terms of packaging, the potential of Fan-Out Panel-Level Packaging (FOPLP) with larger panels, as well as its current challenges, is examined. From an architectural standpoint, optical computing— which leverages photonics—is analyzed, along with its potential future applications based on its inherent characteristics. Additionally, neuromorphic computing—inspired by the operation of human neurons—is discussed, highlighting neuromorphic computing’s advantages and limitations. Regarding materials, the speed advantages of two-dimensional materials (e.g., graphene) are analyzed, along with the potential innovations brought by topological insulators and spintronics. This paper thoroughly examines the challenges currently facing the semiconductor industry from multiple perspectives and proposes several potential solutions, thereby providing significant guidance for breaking through the industry’s current impasse.

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References

[1] Mark S. Lundstrom, Muhammad A. Alam, Moore’s law: The journey ahead, High-performance electronics will focus on increasing the rate of computation, Science, 2022, 378(6621): 722-723.

[2] Lu X. M., Wang X. G. Incorporating heisenberg’s uncertainty principle into quantum multiparameter estimation. Physical Review Letters, 2021, 126(12): 120503.

[3] Kumar S. Fundamental Limits to Moore's Law, Department of electrical engineering, submitted as coursework for PH250, Stanford University, 2012.

[4] Mirzaie M., Hojbota C. I., Kim D. Y., et al. All-optical nonlinear Compton scattering performed with a multi-petawatt laser. Nature Photonics, 2024, 18(11): 1201-1205.

[5] Lee T. C., Chang Y., Hung C. P., et al. Advanced Packaging from FOWLP to FOPLP: Development of fan-out chip last in 300 Mm panel. 2025 IEEE 75th Electronic Components and Technology Conference. IEEE, 2025.

[6] McMahon P. L. The physics of optical computing. Nature Reviews Physics, 2023, 5(12): 717-734.

[7] Rathi N., Chakraborty I., Kosta A., et al. Exploring neuromorphic computing based on spiking neural networks: algorithms to hardware. ACM Computing Surveys, 2023, 55(12): 1-49.

[8] Fan S., Cao R., Wang L., et al. Quantum tunneling in two - dimensional van der Waals heterostructures and devices. Science China Materials, 2021, 64 (10): 2359-2387.

[9] Krishnamoorthy H. N. S., Dubrovkin A. M., Adamo G., et al. Topological insulator metamaterials. Chemical Reviews, 2023, 123(8): 4416-4457.

[10] Venturelli D., Hamze M., Somma R. D., et al. Computational multiqubit tunnelling in programmable quantum annealers. Nature Communications, 2016, 7: 10327.

[11] Sánchez-Trujillo D. J., Osorio-Maldonado L. V., Prías - Barragán J. J. emperature dependence of electrical conductivity and variable hopping range mechanism on graphene oxide films. Scientific Reports, 2023, 13(1): 4810.

[12] Compton effect [EB/OL]. Encyclopædia Britannica, 2025-09-03.

[13] Khalaf M., Kaminer I. Compton scattering driven by intense quantum light. Science Advances, 2023, 9(1): eade0932.

[14] Law of diminishing marginal utility. Economics, Youtube, 2025.

[15] Li X., Hsee C. K., Inman J. J., Plassmann H. The psychology of marginal utility. Journal of Consumer Research, 2020, 47(4): 475-499.

[16] Kim C., Smith A. N., Kim J., et al. Outside good utility and substitution patterns in direct utility models. Science Direct, 2023.

[17] Xu H., Huang X., Zhuang Z., et al. Hierarchical Partitioning-Based Inter-Chip Redistribution Layer Routing for Fan-Out Wafer-Level Packaging. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025.

[18] Kim D. H., Lee J. E., Choi G., et al. Study of reliable via structure for Fan Out Panel Level Package (FoPLP). 2022 IEEE 72nd Electronic Components and Technology Conference. IEEE, 2022: 1063-1069.

[19] Lim J. A., Park Y. M., De Vera E., Kim B. C., Dunlap B. 600mm Fan-Out Panel Level Package (FOPLP) as a scale up alternative to 300mm Fan-Out Panel Level Package (FOWLP) with 6-sided die protection. 2021 IEEE 71st Electronic Components and Technology Conference. IEEE, 2021: 1017-1022.

[20] Zhu H. H., Zou J., Zhang H., Shi Y. Z., Luo S. B., Wang N., et al. Space-efficient optical computing with an integrated chip diffractive neural network. Nature Communications, 2022, 13(1): 1-9.

[21] McMahon P. L. The physics of optical computing. Nature Reviews Physics, 2023, 5(12): 717-734.

[22] Psaltis D. Programming nonlinear propagation for efficient optical learning machines[J]. Advanced Photonics, 2024, 6(1).

[23] Tan C., Šarlija M., Kasabov N. Spiking Neural Networks: Background, Recent Development and the NeuCube Architecture. Neural Processing Letters, 2020, 52(2): 1675-1701.

[24] Rathi N., Chakraborty I., Kosta A., Sengupta A., Ankit A., Panda P., Roy K. Exploring neuromorphic computing based on spiking neural networks: algorithms to hardware. ACM Computing Surveys, 2023, 55(12): 1-49.

[25] Kudithipudi D., Schuman C., Vineyard C. M., Pandit T., Merkel C., et al. Neuromorphic computing at scale. Nature, 2025, 637(8047): 801-812.

[26] Ahmed A. Mechanical Characterization of Graphene Nanoparticles. Smart Nanomaterials Technology, 2023.

[27] Das S., Sebastian A., Pop E., McClellan C. J., Franklin A. D., Grasser T., et al. Transistors based on two - dimensional materials for future integrated circuits. Nature Electronics, 2021, 4 (11): 786-799.

[28] Song Y. L., Shang S. X., et al. Disorder-induced phase transitions in a two-dimensional magnetic topological insulator system. Journal of Physics: Condensed Matter, 2025, 37(9).

[29] Zhang Y., Feng X., Zheng Z., Zhang Z., Lin K., et al. Ferrimagnets for spintronic devices: from materials to applications. Applied Physics Reviews, 2023, 10(1): 011301.