MEMS Precision Sensors Based on Process Innovation Technology
DOI:
https://doi.org/10.54097/6hmeqa88Keywords:
Micro-Electromechanical Systems; Sensor; Etching Process; Single Crystal Wafer.Abstract
This article introduces a novel process for achieving micro-scale thermal isolation through solid porous 3D microstructures. It proposes a method to improve existing thermal MEMS devices by utilizing thin-film membrane structures, develops a model for estimating the thermal conductivity of porous microstructures, and constructs porous 3D microstructures made of three different powder materials, studying their applicability for thermal isolation. Breakthroughs have been achieved in process preparation technology, enabling the production of precision MEMS sensors. These sensors are expected to find wide applications in smart cars, intelligent healthcare, electronic resonance sensors, and other fields.
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