Chip War: Rethinking on the WTO Dispute Settlement Mechanism
DOI:
https://doi.org/10.54097/hbem.v20i.12324Keywords:
Sino-US trade war, chip war, WTO Dispute Settlement Understanding, WTO Dispute Settlement Body, Appellate Body.Abstract
This paper examines the challenges faced by the World Trade Organisation (WTO) Dispute Settlement Mechanism and proposes the necessity for improvement and reform. By analyzing the case of the chip war, the paper identifies the delay and self-compliance as major factors contributing to these challenges. To address these issues, an efficiency reform is proposed, including streamlining procedures, rebuilding the Appellate Body, and strengthening enforcement mechanisms. While several suggestions have been put forward, unresolved issues regarding the restoration of member parties' credibility still require attention. The paper aims to contribute to revitalizing this successful dispute settlement mechanism.
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