Principal Analysis and Application of Laser Technology in Integrated Circuits

Authors

  • Xinyi Li

DOI:

https://doi.org/10.54097/d2hvmn36

Keywords:

Integrated circuit, Laser welding, Laser direct writing, Laser detection, Laser cleaning.

Abstract

Since the constant development of science and technology and the popularization of electronic devices, integrated circuits are also developing in the direction of large scale and high precision. This requires the processing of integrated circuits to be constantly refined. This also prompted the laser technology has become an important processing technology in the manufacturing process of large-scale integrated circuits. Laser processing technology is a non-contact processing, its beam diameter is small, high-energy density, high productivity, stable and reliable processing quality. This paper for the laser welding, laser direct writing, laser detection and laser cleaning overview of the four-laser technology in the application of large-scale integrated circuits. And the working principle, type and process characteristics of these laser technologies are discussed. The development of laser technology has also limited the production of large-scale integrated circuits in some aspects. With the semiconductor laser, excimer laser process continues to mature, laser technology in integrated circuits will continue to expand the scope of application and break through the obstacles.

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References

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Published

26-01-2024

How to Cite

Li, X. (2024). Principal Analysis and Application of Laser Technology in Integrated Circuits. Highlights in Science, Engineering and Technology, 81, 252-257. https://doi.org/10.54097/d2hvmn36